Agentic CLI forRoot Cause Analysisin Engineering and Robotic.
Laplace is Quadapt.ai's deep-research agentic CLI, fusing on-device reasoning, telemetry streams, and deterministic graph traversal to pinpoint the exact source of hardware & software failure in milliseconds, air-gapped, at scale.
Strategic Partners.
Beyond Simple Diagnostics. Deep Research.
Laplace doesn't just flag errors; it performs autonomous multi-modal investigations. It ingests SEM imagery, identifies sub-micron fractures, runs parallel simulations, and synthesizes a complete forensic report in seconds.
A closed-loop diagnostic protocol, engineered for deterministic recovery.
Causal Reconstruction
Tracing anomalies back to their quantum or mechanical origin using Laplace's deep reasoning nodes.
Parallel Simulation
Running hundreds of 'what-if' scenarios in a synthetic sandbox to validate RCA hypotheses.
Autonomous Fix
Deployment of remediation protocols through Laplace's shell command interface (!shell).
A deterministic substrate for industrial intelligence.
Four primitives compose every Laplace deployment, from a single robot to a fleet of 10,000. Air-gapped, inspectable, and verifiable by design.
Multi-Agent Synthesis
A federated cluster of reasoning agents (kinematic, thermal, firmware, and causal) negotiate a single root cause hypothesis via consensus. No hallucinated failure modes.
Air-Gapped Integrity
Runs fully on-premise. Zero telemetry egress. Signed, verifiable weights, auditable by your compliance team.
Contextual Referencing
Every inference cites the telemetry slice, CAD revision, and firmware SHA that produced it. Forensic traceability at the token level.
Sub-Millisecond Heuristics
Graph-traversal is bounded by hard real-time constraints. Guaranteed response envelopes suitable for safety-critical and actuator-loop integration.
A terminal-first control plane for causal diagnosis.
Scriptable, auditable, and designed to integrate with existing SRE and manufacturing-ops toolchains. No dashboard lock-in.
Read CLI DocsReal defects. Detected and annotated autonomously.
Semiconductor Wafer Delamination
Wafer-level failure analysis identifying delamination regions and surface anomalies across the die map.
Copper Cut: Dual Damascene Via Pillar
Cross-section SEM of dual damascene via pillar showing copper voiding and structural delamination in the interconnect stack.
Line Breakage & Pad Contamination
SEM analysis of wire bond interconnects revealing line fractures and pad surface contamination at 1.19KX magnification.